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Technology Partners |
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Microbonds actively engages in
cooperative technology
partnerships with industry
leaders in order to reduce the
time and cost of adoption, and
to improve the performance and
reliability of X-Wire™
Technology. Our technical
programs are primarily designed
to support customer applications
and to assist users in
developing manufacturing
processes using X-Wire™.
Interested companies are
encouraged to contact
sales@microbonds.com. |
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Key Relationships |
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ASM Pacific Technology Ltd.
is a leading supplier of
semiconductor process equipment
in both front- and back-end
markets. The Company possesses a
strong technological base,
state-of-the-art manufacturing
facilities, a competent and
qualified workforce and a highly
trained, strategically
distributed support network.
Each of ASM International's
major products are qualified for
300mm wafer processing, the
wafer size of the future. This
and other leading-edge process
and equipment developments
ensure ASM International a
position of strength and growth
for many years.
ASM International and its
subsidiaries provide production
solutions for wafer processing,
assembly and packaging of
semiconductor devices through
their facilities in the United
States, Europe, Japan and Asia.
The Company is headquartered in
Bilthoven, The Netherlands.
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Press Release |
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ASM and Microbonds
Announce Strategic
Alliance for X-Wire™
Technology for
Package-Level
Interconnect |
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35 kB |
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Literature |
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X-Wire™
Bonding Interconnection
Technology |
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300 kB |
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ASM/SPT Data Sheet |
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115 kB |
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SPT is the leading supplier
of state-of-the-art ultra
precision wire bonding tools
used in the semiconductor
packaging industry. |
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Press Release |
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SPT (Small Precision
Tools) and Microbonds
Announce Technical
Alliance on Advanced
Bonding Tools & X-Wire™
Technology |
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29 kB |
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Literature |
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SPT/Microbonds ::
Application Note - Stitch Bond
Enhancement for X–Wire™ with
Stitch Integrator (SI)
Capillary™ |
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133 kB |
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March Plasma Systems is
global leader in gas plasma
technology for Semiconductor,
Wafer Level Packaging, Printed
Circuit Board and Life Science /
medical device industries. The
company designs and manufactures
a complete line of automated and
batch plasma treatment systems,
and maintains an expert staff of
scientists and engineers trained
in plasma science for advanced
packaging and PCB technology.
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Press Release |
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March Plasma Systems and
Microbonds Announce
Technical Alliance on
Advanced Bonding Tools &
X-Wire™ Technology |
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234 kB |
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Literature |
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March Plasma
Systems/Microbonds
:: Application Note - Plasma
Treatment of X–Wire™ ASM/SPT
Data Sheet |
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106 kB |
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NxGEN Electronics Inc. is an
expert interconnect solutions
provider and developer of
sophisticated electronic
products. NxGEN Electronics’
expertise and services drive
product developments from
concept all the way to fully
developed, turn-key products.
The company’s capabilities
include design and layout
services, modeling, prototype
development, testing, a large
range of fabrication methods and
assembly. NxGEN Electronics is
an innovative leader in custom
packaging solutions, with focus
on developing the next
generation of smaller, lighter
power consumption electronic
products and sensors. |
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Press Release |
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NxGEN Electronics Selects
and Qualifies X-Wire™ Technology
for Use in Microelectronic
Manufacturing Services |
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26 kB |
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Mirror Semiconductor is being
launched as a joint venture
between Liberty University and
TopLine Corporation. Mission is
to be a fabless producer of
“Mirrored Pinout” integrated
circuits and to license Mirrored
Pinout technology to ODM, IDM,
EMS, OEM and packaging
foundries. |
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Press Release |
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Microbonds, Mirror
Semiconductor and PROMEX
Industries Announce
Major Packaging
Technology Alliance |
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729 kB |
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Mirror Semiconductor and
Microbonds Announce
Alliance on Mirrored
Pinout Integrated
Circuits and X-Wire™
Technology |
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25 kB |
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Promex is a leader in
preparing new technologies for
transfer to high-volume
environments. |
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Press Release
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Microbonds, Mirror
Semiconductor and PROMEX
Industries Announce
Major Packaging
Technology Alliance |
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729 kB |
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Nitto Denko is a global
supplier of materials and
equipment for semiconductor
manufacturing, represented by
the following products: ELEP
holder tapes for backgrinding
and dicing; NEL machines (Taper/Detaper/Wafer
Mounter with or without peeling
function/UV machine) for thin
wafer application; ELEPMOUNT
(2-in-1: DAF+Dicing Tape) for
thin stacked chip package;
REVALPHA thermal-release tapes
for various applications, such
as dicing, grinding and MLCC
production process. |
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Press Release |
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Nitto Denko Corporation
and Microbonds Announce
Technical Alliance on
Molding Compounds &
Insulated Bonding Wires |
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16 kB |
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The Centre for Advanced
Materials Joining at the
University of Waterloo [Ontario,
Canada] is directed by Prof. Y.
(Norman) Zhou. The primary goal
of CAMJ is to develop new and
innovative technologies for
materials joining. CAMJ has
cutting edge laboratory
facilities and research areas to
collaborate with leading
companies in the industry for
research and development. CAMJ
trains students on the
undergraduate, Masters, PhD, and
Post Doctoral levels and
collaborates with students from
foreign institutes of excellence
to extend their research. |
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Literature |
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Microelectronic Wire
Bonding with Insulated Au Wire-
Effects of Process Parameters on
Insulation Removal and Crescent
Bonding |
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474 kB |
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Pull
Force and Tail Breaking
Force Optimization of
the Crescent Bonding
Process with Insulated
Au Wire |
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812 kB |
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Literature |
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Utilize Gold
Recognizes X–Wire™ |
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