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PRODUCTS

• X-Wire 2.0 Head Start Kit

Advanced wire bonding technology is constantly being driven to higher geometric capability (finer pitches, longer loops) with new materials resulting in increasing packaging and assembly costs.  X-Wire? Technology addresses some of these critical issues by simply providing a continuous insulative coating with precisely controlled dielectric properties on today?s bonding wires.  Think of the benefits of the Myelin sheath of the human nervous system.  Our license/alliance programs with leaders such as ASM International N.V. ensure ongoing compatibility with the evolution of adjacent technologies and processes.    

LITERATURE

• "Robust Wirebonding of X-Wire ™ Insulated Bonding Wire Technology" By Christopher Carr, Juan Munar, William Crockett, Robert Lyn, Microbonds Inc. Presented at IMAPS 2007, San Jose, CA.

• "Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire" BBy J. Lee, M. Mayer & Y. Zhou, University of Waterloo, J. Persic, Microbonds Inc.  Presented at EPTC 2007, Singapore.  

• Analysis between Wire Bonding and flip Chip Interconnect Technology" By E. Jan Vardaman, President Tech Search International, Inc.

• SPT/Microbonds :: Application Note - Stitch Bond Enhancement for X–Wire™ with Stitch Integrator (SI) Capillary™

• March Plasma Systems/Microbonds :: Application Note - Plasma Treatment of X–Wire™

• Assembly Using X-Wire™ Insulated Bonding Wire Technology (Conference Paper: Semicon Singapore 2007)

• ASM/SPT Data Sheet

• ASM Wire Bonding Brief/ ASM　製品　概要

• X-Wire Technology Product Sheet

• X-Wire White Paper

• X-Wire Technology Overview

• Overview of X-Wire? Insulated Bonding Wire Technology (Conference Paper: IMAPS 2006)

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