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FAQ
This section of website provides answers to frequently asked questions about X-Wire(TM). Should you have any further questions, please consult our Contact Us page.
GENERAL
1. What is X-Wire(TM) insulated bonding wire technology?
- X-Wire(TM) is a proprietary thin film dielectric coating, developed by Microbonds, which is applied to bare bonding wires to create an insulated bonding wire that allows wires to touch without electrical short circuit. The current product version is called X-Wire(TM) 2.5, which is available in 20, 23 & 25 micron diameter gold (Au) base wire.
2. Is X-Wire(TM) 2.5 commercially available?
3. What is a Head Start Kit?
- A Head Start Kit contains the materials and information you will need to prepare your bonding environment and to understand the basic differences between bare wire and insulated wire in the packaging environment. Detailed information is contained in this product bulletin.
4. What are the advantages of using insulated bonding wire vs. standard (bare) bonding wire?
- Insulated bonding wire extends current wire bond design rules by allowing wire touching and crossing, wire sweeping, long wires, and wires beyond current exit angle restrictions.
5. What are the differences between bonding with insulated bonding wire and bare bonding wire?
- When using insulated bonding wire, minor process changes are required, involving:
- Setup of the wire bonder
- Optimizing 1st and 2nd bond parameters
- Optimizing plasma and mold process parameters
- Understanding insulated bonding wire design rules
All of this information is contained in the Head Start Kit.
6. Do I need to replace my existing assembly infrastructure?
- No. X-Wire(TM) 2.5 can be used directly on existing wire bonders, and with minimal changes to the existing assembly infrastructure. Best known methods and recommended process parameters are available from Microbonds and leading industry alliance partners for many applications and are detailed in the Head Start Kit.
7. Is X-Wire(TM) insulated copper bonding wire available?
- Microbonds is currently developing an insulated copper bonding wire, and is planning to set a date for commercial release in Q2 next year. If you have a specific application requiring insulated copper bonding wire, please contact: sales@microbonds.com.
GETTING STARTED
8. How do I get started with X-Wire(TM) 2.5?
- Please contact your local sales representative for MKE or Tanaka Denshi and request an X-Wire(TM) Head Start Kit, which will allow you to set-up your wire bonder and perform initial feasibility testing. The kit contains: wire, capillaries and calibration substrates. The kit also contains a CD-ROM with important technical information, such as process set-up instructions, recommended parameters and application design rules.
9. Which wire bonder models does the X-Wire(TM) 2.5 work with?
- X-Wire(TM) 2.5 has been bonded on ASM and KnS wire bonders, with some preliminary work on Shinkawa and ESEC wire bonders. Detailed wire bonder setup procedures and recommended bonding parameters are available from Microbonds, Tanaka Denshi and MKE, for ASM Eagle® 60 and KnS Maxum series wire bonders. A wire bonder converted for X-Wire can also be used with standard bare gold bonding wire.
10. Can I use my current bare wire 1st and 2nd bond parameters with X-Wire(TM) 2.5?
- No. There are minor, but important differences in FAB and second bond parameters between bare wire and X-Wire(TM) 2.5 bond processes. X-Wire(TM) 2.5 bond parameters should be optimized starting new, using the techniques described in the X-Wire(TM) 2.5 CD-ROM contained in the Head Start Kit.
11. Do you need special first bond parameters for X-Wire(TM) 2.5?
- Yes. First bond parameters are similar, but not equal, to bare bonding wire. Slightly decreasing ultrasonic power and force is recommended to achieve the typical strength, shape and IMC targets required to meet standard industry specifications.
12. Do you need special second bond parameters for X-Wire(TM) 2.5?
- Yes. A strong second bond with insulated wire is achieved by exposing the core bonding wire to the bonding material. To date, it has been found that this can occur through the use of three methods, which are standard features on wire bonders: (1) using high contact velocity, (2) using high initial bond force, and/or (3) by scrubbing the wire and the bonding surface interface. Please refer to the X-Wire(TM) 2.5 CD-ROM contained in the Head Start Kit for specific recommended parameters.
13. Is X-Wire(TM) 2.5 compatible with pre-mold plasma treating processes?
- X-Wire(TM) 2.5 has been successfully tested using 400W / 400sec argon plasma with March PX-1000 systems. A specific magazine and shelf loading configuration is recommended to avoid the possibility of 'hot-spots' in the plasma chamber, which may damage the coating. Additional information is described in this white paper. Specific shelf configurations and process parameters are contained in the X-Wire(TM) 2.5 CD-ROM provided with the Head Start Kit.
14. Is X-Wire(TM) 2.5 compatible with green molding compound with high reflow temperature?
- X-Wire(TM) 2.5 has been shown to be compatible to popular green molding compounds such as: Nitto Denko GE and Sumitomo G760 series EMC, passing MSL-2 and MSL-3 conditions.
15. What is the coating material?
- The coating is a proprietary organic thin film material exhibiting the properties of: high dielectric strength, high crack resistance, high flexural strength, strong adhesion to gold, solvent resistance, high temperature stability, low ionic content and low VOC emission.
16. Is X-Wire(TM) 2.5 ROHS compliant?
- X-Wire(TM) 2.5 does not contain any banned substances described in ROHS guidelines.
17. What are Breaking load and Elongation of X-Wire(TM) 2.5?
- The Breaking Load and Elongation are similar to the original bare gold wire, upon which it is coated.
18. Where can I find additional product and technical information?
- Additional information, such as: application notes, whitepapers and technical conference materials can be downloaded here.
19. How can I get an answer to a specific question not covered on this FAQ page?
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