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MICROBONDS LICENSE/ALLIANCE PROGRAMS
Microbonds actively engages in technical and business licenses/alliances with the industry designed to reduce the time and cost of adoption, and to improve the performance and reliability of X-Wire™ Technology. Our technical license/alliance programs are primarily designed to support customer initiatives and to anticipate potential issues before they appear in production. Interested companies are encouraged to contact the CTO or CEO of Microbonds for further information.
Microbonds also engages in business licenses/alliances designed to foster the development and manufacturing of insulated bond wire and the adoption of insulated bond wire as a broadly qualified interconnect technology. Interested parties are encouraged to contact the CEO of Microbonds for further information.
Key Relationships
Tanaka Kikinzoku is a global provider of precious metal materials, such as bonding wires and targets that support the production of semiconductor devices from wafer to assembly processing. Based in Tokyo, Japan, the company has been in business for over 100 years. Its products play a vital role in industrial fields, such as energy conservation, environmental control, health care, electric and electronics, automobile, telecommunication and semiconductors.
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MKE (KOSDAQ; 033160), headquartered in Yongin, Korea, has been developing and manufacturing core semiconductor materials such as Gold Bonding Wire, Cu Bonding Wire, Sputtering Target, Evaporate materials and Solder Ball, etc since 1982. MKE is now a global market leader, thanks to the unique manufacturing know-how and the patented technologies.
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ASM Pacific Technology Ltd. is a leading supplier of semiconductor process equipment in both front- and back-end markets. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network.
Each of ASM International's major products are qualified for 300mm wafer processing, the wafer size of the future. This and other leading-edge process and equipment developments ensure ASM International a position of strength and growth for many years.
ASM International and its subsidiaries provide production solutions for wafer processing, assembly and packaging of semiconductor devices through their facilities in the United States, Europe, Japan and Asia. The Company is headquartered in Bilthoven, The Netherlands.
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SPT is the leading supplier of state-of-the-art ultra precision wirebonding tools usedin the semiconductor packaging industry.
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March Plasma Systems is global leader in gas plasma technology for Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science / medical device industries. The company designs and manufactures a complete line of automated and batch plasma treatment systems, and maintains an expert staff of scientists and engineers trained in plasma science for advanced packaging and PCB technology.
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Mirror Semiconductor is being launched as a joint venture between Liberty University and TopLine Corporation. Mission is to be a fabless producer of “Mirrored Pinout” integrated circuits and to license Mirrored Pinout technology to ODM, IDM, EMS, OEM and packaging foundries.
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Promex is a leader in preparing new technologies for transfer to high-volume environments.
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Nitto Denko is a global supplier of materials and equipment for semiconductormanufacturing, represented by the following products: ELEP holder tapes for backgrinding and dicing; NEL machines (Taper/Detaper/Wafer Mounter with or without peeling function/UV machine) for thin wafter application; ELEPMOUNT (2-in-1: DAF+Dicing Tape) for thin stacked chip package; REVALPHA thermal-release tapes for various applications, such as dicing, grinding and MLCC production process.
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Cookson Electronics - Semiconductor Products is the premier material supplier to the semiconductor packaging industry for area array and flip chip packages. Cookson Electronics is uniquely positioned to provide total process solutions to our customers.
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