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press releases July 18 , 2008 -LINEAR TECHNOLOGY and MICROBONDS ANNOUNCE QUALIFICATION OF X-WIRE™ TECHNOLOGY Aug 6 , 2007 -MK ELECTRON and Microbonds Announce License Agreement For X–Wire™ Technology June 26, 2007 -Microbonds, Mirror Semiconductor and PROMEX Industries Announce Major Packaging Technology Alliance Mar 7 , 2007 -Mirror Semiconductor and Microbonds Announce Alliance on Mirrored Pinout Integrated Circuits and X–Wire™ Technology Feb 1, 2007 -Microbonds Announces Certification of X–Wire™ Technology at Tanaka's Saga Japan Production Facilities July 6, 2006 -Nitto Denko Corporation and Microbonds Announce Technical Alliance on Molding Compounds & Insulated Bonding Wires July 5, 2006 -Microbonds Announce Release of X–Wire™ Head Start Kit July 5, 2006 -Cookson Electronics and Microbonds Announce Technical Alliance on Plaskon® and X–Wire™ Technology June 29, 2006 -March Plasma Systems and Microbonds Announce Technical Alliance on Advanced Bonding Tools & X–Wire™ Technology June 28, 2006 - SPT (Small Precision Tools) and Microbonds Announce Technical Alliance on Advanced Bonding Tools & X–Wire™ Technology March 24, 2006 - Tanaka And Microbonds Announce License Agreement for X-Wire ™ Technology July 15, 2005 - Kulicke & Soffa And Microbonds Form Joint Alliance on X–Wire™ Technology July 11, 2005 - New Microchip Connection Technology Raises $7 Million in FundingJuly 11, 2005 - Microbonds Expands Management Team July 11, 2005 - ASM And Microbonds Announce Strategic Alliance For X–Wire™ Technology For Package-Level Interconnect July 11, 2005 - MK Electron And Microbonds Announce Strategic Alliance For X–Wire™ Technology July 11, 2005 - Tanaka And Microbonds Announce Strategic Alliance To Release X–Wire™ Technology |
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Copyright © 2006, Microbonds, Inc.
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