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media coverage
Major Packaging
Technology Alliance Announced by Microbonds Inc., Mirror Semi and PROMEX
Volume 11, Number 3
Quarter, 2007
Chip Scale Review The Tuesday Report
Ron Iscoff, Editor, Chip Scale Review
August 7, 2007
Package Development Blends Emerging Technologies
Advanced Packaging
August 1, 2007
Microbonds, Mirror Semiconductor and PROMEX Industries Announce Major Packaging Technology Alliance
PCB007
August 1, 2007
Analysis
between Wire Bonding and flip Chip Interconnect Technology
E.
Jan Vardaman, President Tech Search International, Inc.
July 24, 2007
Download
Presentation here
ASM 2007 Semicon West-Technology Seminar
Space The Final Frontier
ASM International
July 18, 2007
A
New Interconnect Technology in Blooms
Chip
Scale Review
Feature Article by Ron Iscoff, Editor
March 6, 2007
X-Wire Provides a Golden Solution
World Gold Council
Utilize Gold ™
Feb 21, 2007
Joe Fjelstad Interview
PCB007
July 11, 2006
Insulated Wire Technology Hits Mainstream
Advanced Packaging
July 5, 2006
The Week in Packaging
Advanced Packaging
News Analysis by Jeffrey C. Demmin, Advanced Packaging contributing editor
July, 2006
SEMICON West 2006 TechXPOT Offers Special Focus on Test, Assembly and Packaging Technologies
SEMI
May 4, 2006
Insulated Bonding Wire Taking Hold
Semiconductor International
by John Baliga, contributing editor
May 1, 2006
Tanaka Licenses Microbonds' X-Wire Technology (page 19)
InsideChips.Ventures
April, 2006
The Week in Packaging
Advanced Packaging
News Analysis by Jeffrey C. Demmin, Advanced Packaging contributing editor
March, 2006
Electronic Interconnections No.9 - Wire Bonding - Still First Choice for Integrated Circuit Die Interconnection
PCB007
Joe Fjelstad
Friday March 31, 2006
Microbonds licenses insulated-wire bonding technology to Tanaka
The Semiconductor Reporter
March 27, 2006, 7:20 p.m. EST
Dispensing, Encapsulating and Underfilling: Picking the 'Right' Equipment for the Job
Chip Scale Review
Feature Article by Terrence Thompson, Senior Editor
January - February, 2006
Microbonds – Emerging Venture (page 16)
InsideChips.Ventures
August 2005
The Week in Packaging
Advanced Packaging Magazine
News Analysis by Jeffrey C. Demmin, contributing editor
August 08, 2005
K&S, Microbonds form bonder alliance
EE Times
July 26, 2005
K&S to work
with Microbonds on wire bonding with insulated wires
The Semiconductor Reporter
July 22, 2005, 4:50 p.m. EDT
K&S, Microbonds Embark on X-Wire R&D
Electronic
News
July 22, 2005
Microbonds, Tanaka Ally on X-Wire
Electronic
News
July 22, 2005
Microbonds
Connection Technology Attracts $7 million in funding
The Semiconductor Reporter
July 20, 2005,
3:45 p.m. EDT
Coated Wire Bonding Company Raises Funds
EE
Times
By Peter Clarke
July 20, 2005, 10:05 a.m. EDT
The Week in Packaging
Advanced Packaging Magazine
News Analysis by Jeffrey C. Demmin, contributing editor
July 11, 2005
ASMI in
alliance to develop insulated wire bonding process
The Semiconductor Reporter
July 7, 2005, 4 p.m. EDT
ASM, Microbonds to Devise “X-Wire” Packages
EE Times
July 07, 2005 (7:09 PM
EDT)
ASM, Microbonds Ink X-Wire Alliance
Electronic News
July 07, 2005 |
