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Microbonds Presents at:

2007 KGD Packaging & Test Workshop

2007 KGD Packaging & Test 
Workshop
Conference Date: Sep 9-12, 2007
Embassy Suites Napa Valley

Microbonds Presentation
"Advanced Packaging and Wire 
Bonding Techniques Using X–Wire™ 
Insulated Bonding Wire Technology"

Presentation Date: Sep 10, 2007
Time: 3:30pm - 4:00pm PST 
more...

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Semicon Taiwan 2007

Semion Taiwan 2007
Conference Date: Sep 12-14, 2007
Taipei World Trade Center
Taipei, Taiwan

Come see us at
Tanaka Booth: 908
MKE Booth: TBA
more...

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Microbonds Presents at:
Meptec
Luncheon Date: October 10, 2007
Sunnyvale
more...

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