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Canadian Nano-player competes
with global leaders in semi
materials market
Jan 27, 2010 |
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By Robert Lyn, chief technolgy
officer, Microbonds Inc.
Relatively unknown in Canada,
Markham ON-based Microbonds Inc.
has made a name for itself and
its technology outside of
Canada, within the fiercely
competitive market of
microelectronics chip assembly.
While many people are familiar
with silicon chips and
transistors made famous by
companies like Intel and IBM,
what is not commonly understood
is how the information inside
those chips makes its way to the
end-user.
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33 kB |
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UTAC
Selects X-Wire™ Technology for
Volume Production
May 15, 2009 |
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SINGAPORE & TOKYO &
TORONTO--(Business Wire)--
United Test and Assembly Center
(UTAC), Tanaka Denshi Kogyo K.K.
and Microbonds
Inc. (all privately held
companies) are pleased to
announce that UTAC has
selected Tanaka X-Wire insulated
wire bonding technology for
volume production
to enable advanced IC package
assembly and material cost
savings.
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27 kB |
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NxGEN
Electronics Selects and
Qualifies X-Wire™ Technology for
Use in Microelectronic
Manufacturing Services
Apr 22, 2009 |
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(San Diego, California; Tokyo,
Japan; Toronto, Canada) —
NxGEN Electronics , Tanaka
Denshi Kogyo K.K. and Microbonds
Inc. (all privately held
companies) are pleased to
announce that NxGEN Electronics,
Inc. has qualified Tanaka
X-Wire™ insulated wire bonding
technology and now offers this
novel interconnect approach to
its customer.
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26 kB |
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Linear
Technology and Microbonds
Announce Qualification Of
X-Wire™ Technology
July 18,
2008 |
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MILPITAS, Calif. &
TORONTO--(Business Wire)--
Linear Technology Corporation (NASDAQ:LLTC)
and Microbonds Inc. (a
private Canadian corporation)
have announced successful
qualification
of Microbonds X-Wire(TM)
insulated wire bonding
technology to enable
design flexibility for Linear
Technology's advanced IC
packages.
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18 kB |
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Archived Press Releases |
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2007 |
Link |
File |
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MK Electron and
Microbonds Announce
License Agreement for
X-Wire™ Technology;
Aug 6, 2007 |
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105 kB |
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Microbonds and PROMEX
Industries Announce
Major Packaging
Technology Alliance,
Jul 16, 2007 |
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311 kB |
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Microbonds, Mirror
Semiconductor and PROMEX
Industries Announce
Major Packaging
Technology Alliance,
Jun 26, 2007 |
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729 kB |
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Mirror Semiconductor and
Microbonds Announce
Alliance on Mirrored
Pinout Integrated
Circuits and X-Wire™
Technology;
Mar 7, 2007 |
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25 kB |
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Microbonds Announces
Certification of X-Wire™
Technology and Tanaka's
Saga Japan Production
Facilities;
Feb 1, 2007 |
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41 kB |
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2006 |
Link |
File |
Size |
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Nitto Denko Corporation
and Microbonds Announce
Technical Alliance on
Molding Compounds &
Insulated Bonding Wires;
Jul 6, 2006 |
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16 kB |
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Microbonds Announce
Release of X-Wire™ Head
Start Kit;
Jul 5, 2006 |
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15 kB |
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Cookson Electronics and
Microbonds Announce
Technical Alliance on
Plaskon® and X-Wire™
Technology;
Jul 5, 2006 |
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25 kB |
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March Plasma Systems and
Microbonds Announce
Technical Alliance on
Advanced Bonding Tools &
X-Wire™ Technology;
Jun 29, 2006 |
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234 kB |
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SPT (Small Precision
Tools) and Microbonds
Announce Technical
Alliance on Advanced
Bonding Tools & X-Wire™
Technology;
Jun 28, 2006 |
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29 kB |
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Tanaka and Microbonds
Announce License
Agreement for X-Wire™
Technology;
Mar 24, 2006 |
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16 kB |
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2005 |
Link |
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Kulicke & Soffa and
Microbonds Form Joint
Alliance on X-Wire™
Technology;
Jul 15, 2005 |
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76 kB |
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New Microchip Connection
Technology Raises $7
Million of Funding;
Jul 11, 2005 |
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27 kB |
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Microbonds Expands
Management Team,
Jul 11, 2005 |
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25 kB |
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ASM and Microbonds
Announce Strategic
Alliance for X-Wire™
Technology for
Package-Level
Interconnect;
Jul 11, 2005 |
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35 kB |
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MK Electron and
Microbonds Announce
Strategic Alliance for
X-Wire™ Technology;
Jul 11, 2005 |
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41 kB |
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Tanaka and Microbonds
Announce Strategic
Alliance to Release
X-Wire™ Technology;
Jul 11, 2005 |
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30 kB |
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Media Coverage |
Link |
File |
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2007 |
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Chip Scale Review The
Tuesday Report;
Ron Iscoff, Editor, Chip
Scale Review, Aug 7,
2007 |
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182 kB |
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Package Development
Blends Emerging
Technologies;
Advanced Packaging, Aug
1, 2007 |
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Microbonds, Mirror
Semiconductor and PROMEX
Industries Announce
Major Packaging
Technology Alliance;
PCB007, Aug 1, 2007 |
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Analysis Between Wire
Bonding and Flip Chip
Interconnect Technology;
E. Jan Vardaman,
President Tech Search
International, Inc., Jul
24, 2007 |
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2.7 Mb |
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ASM 2007 Semicon
West-Technology Seminar;
Space The Final
Frontier, ASM
International, Jul 18,
2007 |
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A New Interconnect
Technology in Blooms;
Chip Scale Review,
Feature Article by Ron
Iscoff, Editor, Mar 6,
2007 |
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327 kB |
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X-Wire™ Provides a
Golden Solution;
World Gold Council,
Utilize Gold, Feb 21,
2007 |
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2006 |
Link |
File |
Size |
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Joe Fjelstad Interview;
PCB007, Jul 11, 2006
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Insulated Wire
Technology Hits
Mainstream;
Advanced Packaging, Jul
5, 2006 |
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The Week in Packaging;
Advanced Packaging, News
Analysis by Jeffrey C.
Demmin, Advanced
Packaging Contributing
Editor, Jul, 2006 |
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Semicon West 2006
TechXPOT Offers Special
Focus On Test Assembly
and Packaging
Technologies;
SEMI May 4, 2006 |
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Insulated Bonding Wire
Taking Hold;
Semiconductor
International by John
Baliga, Contributing
Editor, May 1, 2006 |
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Tanaka Licenses
Microbonds' X-Wire™
Technology; InsideChips.Ventures™,
Volume 7, Number 4, pg
19, April, 2006 |
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202 kB |
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The Week in Packaging;
Advanced Packaging, News
Analysis by Jeffrey C.
Demmin, Advanced
Packaging Contributing
Editor, Mar, 2006 |
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Electronic
Interconnections No.9 -
Wire Bonding - Still
First Choice for
Integrated Circuit Die
Interconnection;
PCB007, Joe Fjelstad,
Friday, Mar 31, 2006 |
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Microbonds Licenses
Insulated-Wire Bonding
Technology to Tanaka;
The Semiconductor
Reporter, Mar 27, 2006 |
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Dispensing,
Encapsulating and
Underfilling: Picking
the 'Right' Equipment
for the Job;
Chip Scale Review,
Feature Article by
Terrence Thompson,
Senior Editor Jan - Feb,
2006 |
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2005 |
Link |
File |
Size |
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Microbonds – Emerging
Venture; pg
16, InsideChips.Ventures,
Aug 2005 |
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The Week in Packaging;
Advanced Packaging
Magazine, News Analysis
by Jeffrey C. Demmin,
Contributing Editor, Aug
8, 2005 |
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K&S, Microbonds Form
Bonder Alliance;
EE Times, Jul 26, 2005 |
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K&S to Work with
Microbonds on Wire
Bonding With Insulated
Wires; The
Semiconductor Reporter,
Jul 22, 2005 |
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K&S, Microbonds Embark
on X-Wire™ R&D;
Electronic News, Jul 22,
2005 |
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Microbonds, Tanaka Ally
on X-Wire™;
Electronic News, Jul 22,
2005 |
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Microbonds Connection
Technology Attracts $7
Million in Funding;
The Semiconductor
Reporter, Jul 20, 2005 |
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Coated Wire Bonding
Company Raises Funds;
EE Times, by Peter
Clarke, Jul 20, 2005 |
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The Week in Packaging;
Advanced Packaging
Magazine,
News Analysis by Jeffrey
C. Demmin, Contributing
Editor, Jul 11, 2005 |
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ASMI in Alliance to
Develop Insulated Wire
Bonding Process;
The Semiconductor
Reporter, Jul 7, 2005 |
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ASM, Microbonds to
Devise “X-Wire™”
Packages; EE
Times, Jul 07, 2005 |
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ASM, Microbonds Ink
X-Wire™ Alliance;
Electronic News, July 7,
2005 |
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