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July 18, 2008 LINEAR TECHNOLOGY and MICROBONDS ANNOUNCE QUALIFICATION OF X-WIRE™ TECHNOLOGY more...
August 6, 2007 MK ELECTRON and Microbonds Announce License Agreement For X–Wire™ Technology more...
February 1, 2007 Microbonds Announces Certification of X–Wire™ Technology at Tanaka's Saga Japan Production Facilities on February 1, 2007 more... |
X–Wire™ Technology Featured at:
 Insulated Bonding Wire Now Recognized by: ITRS 2006 Update Assembly & Packaging
Click here for more info
June 26, 2007 Microbonds, Mirror Semiconductor and PROMEX Industries Announce Major Packaging Technology Alliance more... |
Microbonds Presents at:
"Bondability and Reliability of X–Wire™Insulated Wire for Advanced Packaging Applications" See it Here... Semion West 2008 Conference Date: July 15-17, 2008 Moscone Centre San Francisco Come see us at Tanaka Booth: North Hall - 6547 MKE Booth: West Hall - Level 2 #8544
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Copyright © 2006-2008, Microbonds, Inc. |
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