Timeline of Microbonds Inc.

 

1 996 - 2008
Semi-Conductor Era

The Beginning of Microbonds Inc. & X-Wire Technology

Founded in 1996 by 2 former IBM Engineers in the semiconductor industry, Microbonds developed a breakthrough nano-insulation coating on gold wires to solve a 50 year-old problem in semiconductor microchip connection (allowing more chip interconnection by enabling bonding wires to touch without short-circuit). The technology was adopted by almost all major chip companies: e.g. Intel, Motorola, Samsung, etc...

- Microbonds

2008
ThermoPlating™ For Electronics Era

The Pivot

In 2008, the semiconductor market quickly switched from gold wire to palladium-electroplated-copper wire and Microbonds had to rapidly innovate a new way of plating metals, such as copper, silver & zinc , and developed a proprietary process called ThermoPlating™, which is a breakthrough technology within the metal plating industry.

2012 - 2015
Palladium Coating & the Beginning of ThermoPlating™

NSERC CRD uWaterloo Fund Granted for Palladium Coating Development

Microbonds Inc. engaged with Dr. Michael A. Mayer from the Department of Mechanical and Mechatronics Engineering of the University of Waterloo to work on a collaborative research and development grant project titled: "Development of Novel Palladium Coated Bonding Wire for Microelectronics".

- NSERC Funding Approval 2012
- NSERC Final Report 2015

2014

Microbonds and Aumann to exhibit breakthrough silver ThermoPlating™ Technology at Wire & Shanghai 2014



- Microbonds Inc. & Aumann Partnership

2015 - 2016

NSERC CRD uWaterloo Fund Granted for Organometallic Development

Micrbonds Inc. engaged with Dr. W.A. Anderson from the Department of Chemical Engineering of the University of Waterloo to work the engage grant project titled : "Properties of Novel Silver Coatings".

- NSERC Partnership Approval Letter
- NSERC Funding Approval 2015
- NSERC Term & Conditions 2015

2016 - 2019

NSERC CRD uWaterloo Fund Granted for Organometallic Development

Microbonds Inc. re-engaged with Dr. Michael A. Mayer from the Department of Mechanical and Mechatronics of the University of Waterloo to work on the collaborateive research and development grants project titled : "Metallizing technologies for oganometallic liquids".

- NSERC Acknowledgement Letter 2016
- Conductive Pathway on Cotton Research Paper 2017
- NSERC Funding Approval 2018
- NSERC Final Report 2019

2019 - Present Day

Microbonds Inc.'s Emerging Thermoplating Technology

Microbonds Inc. now offers metal-based technology. Through our proprietary Thermoplating technology, we are now able to provide an enhanced and long-lasting solution by deeply-infusing metals into various fibers in textile and fabrics. We are currently focusing on the development of a broad product line with our silver-infused and copper-infused technology.

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