Microbonds Inc. is a pioneer and leader in the research, development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. Microbonds’ proprietary chemistry invention is a key to this breakthrough that is poised to sustain and extend an existing US$20B+ wire bond infrastructure and US $4B+ consumables marketplace. Microbonds technology is proven on coated gold bonding wire and is well positioned to capitalize on the growing market demand for coated copper bonding wires.

Quick Facts about Microbonds Inc.:

Inventors of X-Wire™ Technology insulated bonding wire.

Licensed X-Wire™ Technology to key bonding wire supply chain partners Tanaka Denshi Kogyo K.K (Japan) and M.K. Electron Ltd. (Korea).

Strong foundation in materials science, engineering, semiconductor and microchip packaging.

State-of-the-art manufacturing, research, development, and engineering.

Capabilities including clean room facilities for nano-scale ultra fine wire coating, wire bonding, transfer molding, inspection, testing, and analysis.

Locations in Canada (Toronto), USA (San Jose) & Singapore.