 |
|
 |
|
|
OUR PEOPLE
Craig Geier 905-305-0980 x 238 Joined Microbonds fall 2001 bringing over 20 years of finance & business development experience gained in a broad range of industries and diverse working environments from early stage start-ups to major publicly traded corporations (i.e. TrizecHahn Corporation & Bell Canada Enterprises). Craig completed the Honours Business Administration Program at the University of Western Ontario.
William (Bud) Crockett Bud received a B.S. degree in Industrial Engineering from Cal Poly State University in San Luis Obispo, California. Prior to receiving his degree, he proudly served in the US Navy for 8 years as weapons control radar systems technician. Before joining Microbonds in the summer of 2005, he worked for 6 years at STATSChipPAC where he had extensive experience in Product Engineering, Technical Program Management and factory Operations. Bud also worked 3 years as an applications engineer for a global semiconductor equipment manufacturer. He was responsible for installing and qualifying equipment. throughout Asia. Bud is involved in all customer technology developments and qualifications at Microbonds. He is currently focused on industry alliance relationships to support the broad commercial adoption of Microbonds technology to the marketplace.
Domenic Romeo Domenic holds an Honours B.A.Sc. in Mechanical Engineering from the University of Toronto, and is licensed with Professional Engineers Ontario. Domenic was previously with Celestica’s Power Division in Toronto, where he was an Advisory Engineer responsible for new process equipment development and qualification, manufacturing process flows for new products, and providing process engineering and mechanical failure analysis support for international product and technology transfers. While at Celestica, Domenic also held the roles Staff Engineer and Sr. Associate Team Leader in the Power Division.
Robert Lyn Founder & CTO rlyn@microbonds.com 905-305-0980 x225 Robert holds a BA Sc degree in Mechanical Engineering from the University of Toronto, and has over 10 years of experience in the microelectronics industry with IBM Microelectronics and Celestica Inc. Robert was a senior staff engineer in the advanced packaging development division where he led a team which introduced a number of strategic microelectronics packaging technologies into the manufacturing process, including Chip-on-Board wire bonding technology, Flip Chip technology, Ball Grid Array chip carriers, Multi-chip modules, and single chip packaging. These technologies have supported product offerings, such as; PCMCIA Notebook cards, SIMM memory cards, RF/Wireless cards, Networking cards, Power Technology, PC motherboards, Workstations, Mainframe computers and Internet routing systems.
John
Persic John holds a a BA Sc degree in Material Science from the University of Toronto, as well as a MASc degree in Applied Science from the University of Toronto, specializing in the area of Metallurgy and Material Science. John has nearly 10 years of experience in the microelectronics industry. At Celestica, he served as a staff engineer in the process engineering and development division working on process improvements, new product development, and troubleshooting. As a project leader he was responsible for numerous microelectronics packaging and assembly projects, such as wirebonding improvements, encapsulation, contamination control, lead-free solder, conductive adhesives, flip chip/chip scale package development, fluxless soldering, wave-soldering, SMT improvements, chip carrier design, and microvia qualification and testing. John has served as the ISO 9000 Quality representative for Process Engineering and performed ISO and SCC audits, resolved non-conformances and facilitated ISO 9000 training courses. |
|
Home | Contact | Legal Copyright © 2005-2008, Microbonds, Inc.
|
|
