Position Description:

The Field Application Engineer provides on-site technical support to our customers and technology licensees during the initial deployment stage and during the production ramp-up stage. The FAE acts as the primary engineering interface between the customer and the corporate office and provides input into the company’s research and product development activities.
The position requires an individual who possesses in-depth technical knowledge and excellent communication skills working with customers.
Preference will be given towards individuals currently resident in Asia, with travel required within the Asia-Pacific region and North America.

Position Duties:

• Work with Microbonds’ team and customers to develop IC packaging solutions, from feasibility through to mass production.
• Travel on-site to customer facilities as required and support technology implementation.
• Provide technical support to alliance partner and technology licensees.
• Support system start-up, customer training and ongoing customer requirements.
• Provide process and equipment troubleshooting.
• Execute root cause analysis of field problems.

Qualifications:

• Minimum 5 years experience in the electronics assembly industry.
• Strong technical and communications skills.
• Hands on Wire Bonding process and IC Packaging experience.
• Experience with process development and process start-up.
• Good project management skills.
• Bilingualism: English and Japanese/Korean/Mandarin.
• Ability to travel within Asia and to Canada, as required.

Education:

A post-secondary diploma in engineering or technical equivalent.