August 6, 2007

MK ELECTRON and Microbonds Announce License Agreement For X–Wire™ Technology more...

June 26, 2007

Microbonds, Mirror Semiconductor and PROMEX Industries Announce Major Packaging Technology Alliance more...

February 1, 2007

Microbonds Announces Certification of X–Wire™ Technology at Tanaka's Saga Japan Production Facilities on February 1, 2007 more...

Insulated Bonding Wire Now Recognized by:

ITRS 2006 Update Assembly & Packaging
Click here for more info

X–Wire™ Technology Featured in:

"Analysis between Wire Bonding and 
flip Chip Interconnect Technology"

By E. Jan Vardaman, President 
Tech Search International, Inc.
July 24, 2007

Download Presentation Here...

Microbonds Presents at:

2007 KGD Packaging & Test 
Workshop
Conference Date: Sep 9-12, 2007
Embassy Suites Napa Valley

Microbonds Presentation
"Advanced Packaging and Wire 
Bonding Techniques Using X–Wire™ 
Insulated Bonding Wire Technology"

Presentation Date: Sep 10, 2007
Time: 3:30pm - 4:00pm PST 
more...





Semion Singapore 2008
Conference Date: May 5-7, 2008
Exhibition Hall 401 – 404, Level 4
Suntec Singapore International 
Convention and Exhibition Centre
Singapore

Come see us at
Tanaka Booth: 508
MKE Booth: 1317
more...

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