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Microbonds
Inc. is a pioneer and leader in
the research, development and
application of
insulated bonding wire
technology for the semiconductor
packaging and microchip
industries. The company’s X-Wire™
Technology enables the
development of faster, smaller
and cheaper microchips while
improving manufacturing
reliability. |
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X-Wire™ Licensee Partners |
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UTAC Selects X-Wire™ Technology
for Volume Production,
May 15,
2009
[PDF, 27 kB] |
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MORE
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NxGEN Electronics Selects and
Qualifies X-Wire™ Technology for
Use in Microelectronic
Manufacturing Services,
Apr 22,
2009
[PDF, 26 kB] |
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MORE
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Linear
Technology and Microbonds
Announce Qualification Of
X-Wire™ Technology,
Jul 18,
2008
[PDF, 18 kB] |
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MORE
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